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In this wave of ChatGPT-fueled generative AI, Foxconn has leveraged its long-established position in the server industry to continue to be involved in the AI ecosystem. Whether it's the manufacturing ...
In this podcast, Terri Quinn from LLNL provides an update on Hardware and Integration (HI) at the Exascale Computing Project. The US Department of Energy (DOE) national laboratories will acquire, ...
Real-time hypervisors — the central technology for workload consolidation — enable the safe execution of multiple workloads ...
Integration of JUMPtec modules creates the world’s most comprehensive portfolio of application-ready COM platforms SAN ...
Hardware accelerators — specialized devices used to perform specific tasks like classifying objects — are increasingly embedded into system-on-chips (SoCs) serving various AI applications. They help ...
Emerging trends such as AI, edge/IIoT, cybersecurity, and virtualization are increasing the complexity of embedded and edge computing solutions. Application-ready Computer-on-Modules can help OEMs ...
The Exascale Computing Project (ECP) has selected Berkeley Lab’s Katie Antypas as its new Director for the project’s Hardware & Integration Focus Area, effective May 11, 2020. Katie will be replacing ...
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