TE Connectivity recently unveiled its extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional molded socket technologies.

Galileo is a test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to ...

TE Connectivity (TE), formerly Tyco Electronics, has developed a surface-mount LGA 2011 socket specifically for Intel Corp's Core i7 and Xeon 5 CPU processors. The contacts of TE's new LGA 2011 socket ...

The 0.8 mm pitch BGA socket adapter from Ironwood Electronics provides an interposer solution for prototyping, testing and ...

Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

Serving the role of connecting a device and its tester, test sockets—also known as package probes—play a crucial interconnect role in integrated circuits (IC), and therefore the greater field of ...