Samsung Electro-Mechanics and LG Innotek are focusing on the high-value semiconductor substrate "flip chip ball grid array" (FC-BGA) to diversify their business portfolios. But as Taiwan's TSMC, the ...
LG Innotek recently unveiled the latest FC-BGA for the first time at the 'CES 2023'. LG Innotek's FC-BGA is highly integrated, multi layered and large scaled. Also, it has fine patterning and a lot of ...
Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...
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LG Innotek’s ‘Dream Factory’ revolutionizes chip substrate production with AI, robotics
LG Innotek’s “Dream Factory” in Gumi, North Gyeongsang Province, was in full operation on April 17, producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These ...
CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...
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