[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

[Howard Matthews] mills his own PCBs, and man, does he hate drilling through-holes. Manually changing the bits between engraving and drilling after isolation routing? What is this? The stone age?

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

The unparalleled pin density and low lead inductance of ball grid arrays (BGA) are essential in today’s high pin count, high frequency integrated circuits. However, that same pin density and unique ...

Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today’s high pin count, ...