The company is unveiling an entirely new design for the silicon and metal vehicles that connect the microprocessor to the rest of the computer. Michael Kanellos is editor at large at CNET News.com, ...

Lam Research powers AI chipmaking with leading etch/deposition tools and recurring service revenue. Click here to find out ...

Apple Inc. today announced that it will become the first and largest customer of a $2 billion chip packaging facility Amkor Technology Inc. is building in Arizona. The facility will process chips that ...

Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem. After establishing dominance in the critical thermal ...

TOKYO/SEOUL, March 31 (Reuters) - South Korea's Samsung Electronics Co Ltd 005930.KS is considering setting up a chip test line in Japan, five people said, to bolster its advanced packaging business ...

In southern Taiwan, suppliers once tied to steel, plastics, and display panels are pivoting toward chipmaking as booming AI demand and geopolitical risks push chipmakers to localize sourcing.

Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end ...

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the ...

This is the fifth part of the series on chip packaging technologies. In this episode, Dr. Navid Asadi’s group takes a look at chip production and manufacturing processes. Navid Asadi is an assistant ...

TOKYO/SEOUL, March 31 (Reuters) - South Korea's Samsung Electronics Co Ltd (005930.KS), opens new tab is considering setting up a chip packaging test line in Japan, five people said, to bolster its ...