Design of power/driver ICs in compliance with latchup qualification requirements involves a conceptually different approach in comparison with digital LV (low voltage) ICs. The LV ICs’ electrostatic ...

Internet of Things (IoT) applications depend on smart objects that interact with the real world. So your IoT project is likely to contain ICs that integrate micro electro-mechanical systems (MEMS), ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...

In 2022, the overall revenue of the global IC design industry reached US$215.4 billion. Among them, the US IC design sector is the largest in scale, with a 63% market share and revenue of over US$130 ...