If you want to build cool things these days, you’ve probably had to master surface mount electronics. However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

The W3EG2128M72AFSR 2-Gbyte registered ECC DDR SDRAM module consists of thirty-six 512-Mbit fine ball grid array (FBGA) packages mounted on a 184-pin DIMM. Structured as two ranks of 128-M x 72-bit ...

The WV3EG232M64EFSU-D4 is a 2 x 32M x 64 double data-rate (DDR)SDRAM unbuffered memory module based on 256 MB SDRAM components. It consists of sixteen 32 MB x 8 DDR SDRAMs in a fine ball-grid array ...