Yokogawa said its latest high-voltage, wide-bandwidth probe can stay on top of the faster switching speeds of next-generation power electronics like SiC. A new high-voltage, wide-bandwidth probe gives ...

Two new tunnel magnetoresistance (TMR) current sensors streamlined for low noise and high power density designs aim to facilitate precise current measurements for artificial intelligence (AI), data ...

Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing secure, high-speed connectivity solutions that deliver improved reliability and energy efficiency for the next ...

The evolution of DDR5 and DDR6 represents a inflexion point in AI system architecture, delivering enhanced memory bandwidth, lower latency, and greater scalability.

SanDisk just held its first Investor Day since being spun off from Western Digital, and while most of the event was the usual financial talk, the company also gave a glimpse into its R&D priorities.

As scaling at advanced nodes becomes increasingly constrained by cost, yield, and power density, semiconductor innovation is shifting decisively toward 3D-IC technologies, chiplets, and heterogeneous ...

With advancement in technology, processors and other high-speed digital components such as CPUs, GPUs, ASICs, and FPGAs demand increasingly higher power, which means voltage regulators need to be able ...

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Nvidia (NASDAQ:NVDA) is slated to use high-bandwidth memory chips from Samsung (OTCPK:SSNLF) for its artificial intelligence processors, Nikkei Asia reported. Nvidia is "spending a lot of money" on ...