Samsung plans to adopt hybrid bonding technology for its HBM4 to reduce thermals and enable an ultra-wide memory interface, the company revealed at the AI Semiconductor Forum held in Seoul, South ...

When the subject of hybrid bonding is brought up in the industry, the focus is often on how this technique is used to manufacture CMOS image sensors (CIS), an essential device for today’s digital ...

Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment suppliers are racing ...

TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding.

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the ...

BE Semiconductor is a small but high-potential semiconductor equipment manufacturer with a strong market position in Die Attach. The company has great growth prospects, a healthy balance sheet and ...

SAN JOSE, Calif.--(BUSINESS WIRE)-- Xperi Holding Corporation™ (NASDAQ: XPER) (“Xperi”) today announced that the company entered into a license agreement with Yangtze Memory Technologies Co., Ltd.

With the increased prevalence of generative AI, the demand for High Bandwidth Memory (HBM) is rapidly rising, leading to heightened competition in stacking. For HBMs, a higher stack means the ...

BESIY's share price has fallen significantly in recent months, making it worthwhile taking another look at the company. Despite the short-term noise, BESIY's fundamentals are still of high- quality.

DELRAY BEACH, Fla., Dec. 11, 2025 /PRNewswire/ -- According to MarketsandMarkets, the global Hybrid Bonding Market is projected to reach USD 633.9 million by 2032 from USD 164.7 million in 2025, ...