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Intel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidth
Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...
Embedded Multi-die Interconnect Bridge-T (EMIB-T) was a prominent highlight of the Intel Foundry Direct Connect event. Intel is promoting this advanced packaging technology as a key building block for ...
TL;DR: Intel has hired TSMC's former Senior VP Wei-Jen Lo to lead advanced packaging efforts at its Arizona fab, targeting major US tech clients like NVIDIA, Tesla, Microsoft, and Qualcomm. This ...
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