A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has unusual ...

Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...

South Korean researchers have developed a process to produce ultra-thin wafers without sacrificing any of the substrates. Their technique is based on a new approach involving the use of ...

While much of the focus on the impending move to 450mm has focused on the equipment challenges, the wafers themselves are of course the primordial consideration. Predictions are starting to mount up ...

Oct 29, 2024, Munich – 29 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever ...

Ibis Technology Corp. today announced it has started shipping its Advantox MLD-UT wafers that offer an ultra-thin silicon layer as thin as 300-angstroms. According to the Danvers, Mass.-based company, ...

The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance semiconductor assembly packaging technology ...

FREMONT, Calif., Sept. 15, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer-processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

German wafer manufacturer NexWafe GmbH announced it achieved a power conversion efficiency of 24.4% for a heterojunction (HJT) solar cell built with its ultrathin wafers. The company said the ...

FREMONT, Calif., Sept. 15, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer-processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...