Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...

Heterogeneous computing systems integrate diverse processing elements—including central processing units (CPUs), graphics processing units (GPUs) and field-programmable gate arrays (FPGAs)—within a ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

This review article, authored by Dr. Weidong Zhang’s team from Shanghai Jiao Tong University, was recently published in the journal Robot Learning. Focusing on the increasingly prominent topic of ...