Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

VIA Labs, Inc. (VLI), a leading supplier of USB4, SuperSpeed USB, USB 2.0, and USB Power Delivery Controllers, announced its ...

Shravan Padur's Blueprint for AI-Driven Platform Engineering and Automation-First M&A Integration - In a year marked by unprecedented consolidation across global industries, the true measure of ...

Pediatric ENT emergencies pose unique risks because small anatomic airways can make minor pathology life-threatening in minutes. The WHO pediatric emergency care framework underscores the urgency of ...

Abstract: Hybrid wireless sensing nodes, composed of different sampling/processing and communication interfaces are gaining increasing interest in industrial scenarios thanks to their capability to ...

Software architecture must become intelligent, explainable, and adaptive. Only then can systems keep up with modern ...

Tesla is quietly sketching out a future where the glass above your head is more than a panoramic sunroof. In a series of ...

Electronics design and sourcing processes are set to become faster and more efficient following the integration of the CELUS Design Platform with AGS Devices’ online services. The partnership, ...

Abstract: In this article, an antenna system that seamlessly integrates millimeter-wave (mmWave) active phased array modules and an ultrawideband Sub-6 GHz antenna is proposed for future ...